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datasheet www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 14 ? 001 1/15 03.july.2014 rev.005 voltage detector ic series counter timer built-in cmos voltage detector ic bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series general description rohms bu45xxxxx and bu46xxxxx series are highly accurate, low current consumption voltage detector ic series. because the counter timer delay circuit is built-in, an external capacitor for the delay time setting is unnecessary. two output types are available (nch op en drain and cmos output) and detection voltages range from 2.3v to 4.8v in increments of 0.1v with fixed d elay time of 200ms and 400ms, that may be selected according to application. features counter timer built-in no delay time setting capacitor required low current consumption two output types (nch open drain and cmos output) package ssop3 is similar to sot-23-3 (jedec) key specifications detection voltage: 2.3v to 4.8v (typ.) 0.1v steps high accuracy detection voltage: 1.0% low current consumption: 2.3a (typ.) operating temperature range: -40c to +105c two internal, fixed delay time: 200ms 400ms package ssop3 2.92mm x 2.80mm x 1.25mm applications circuits using microcontrollers or logic circuits t hat require a reset typical application circuit connection diagram pin descriptions bu45kxxxg / bu46kxxxg bu45lxxxg / bu46lxxxg pin no. symbol function 1 gnd gnd 2 v out reset output 3 v dd power supply voltage pin no. symbol function 1 v out reset output 2 v dd power supply voltage 3 gnd gnd open drain output type bu45xxxxx series cmos output type bu46xxxxx series product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays. v dd1 v dd2 gnd bu45 x x x xx c l noise-filtering capacitor r l r st micro controller top vi ew ssop3 bu45k g bu46k g 1 2 3 v out v dd gnd c l noise-filtering capacitor v dd1 gnd bd46 xx x xx r st micro controller bu45l g bu46l g 1 2 3 gnd v out v dd downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 2/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet i i : i : i i i iii : : : 8 : 8 : g i g g i g ordering information lineup table 1. open drain output type counter timer delay time settings 1-pin gnd 3-pin gnd 200ms 400ms 200ms 400ms detection voltage marking part number marking part number marking part number marking part number 4.8v bh bu45k482 ef bu45k484 hd bu45l482 nb bu45l484 4.7v bg bu45k472 ee bu45k474 hc bu45l472 na bu45l474 4.6v bf bu45k462 ed bu45k464 hb bu45l462 my bu45l464 4.5v be bu45k452 ec bu45k454 ha bu45l452 mx bu45l454 4.4v bd bu45k442 eb bu45k444 gy bu45l442 mw bu45l444 4.3v bc bu45k432 ea bu45k434 gx bu45l432 mt bu45l434 4.2v bb bu45k422 dy bu45k424 gw bu45l422 ms bu45l424 4.1v ba bu45k412 dx bu45k414 gt bu45l412 mr bu45l414 4.0v ay bu45k402 dw bu45k404 gs bu45l402 mp bu45l404 3.9v ax bu45k392 dt bu45k394 gr bu45l392 mn bu45l394 3.8v aw bu45k382 ds bu45k384 gp bu45l382 mm bu45l384 3.7v at bu45k372 dr bu45k374 gn bu45l372 mk bu45l374 3.6v as bu45k362 dp bu45k364 gm bu45l362 mh bu45l364 3.5v ar bu45k352 dn bu45k354 gk bu45l352 mg bu45l354 3.4v ap bu45k342 dm bu45k344 gh bu45l342 mf bu45l344 3.3v an bu45k332 dk bu45k334 gg bu45l332 me bu45l334 3.2 v am bu45k322 dh bu45k324 gf bu45l322 md bu45l324 3.1v ak bu45k312 dg bu45k314 ge bu45l312 mc bu45l314 3.0v ah bu45k302 df bu45k304 gd bu45l302 mb bu45l304 2.9v ag bu45k292 de bu45k294 gc bu45l292 ma bu45l294 2.8v af bu45k282 dd bu45k284 gb bu45l282 ky bu45l284 2.7v ae bu45k272 dc bu45k274 ga bu45l272 kx bu45l274 2.6v ad bu45k262 db bu45k264 fy bu45l262 kw bu45l264 2.5v ac bu45k252 da bu45k254 fx bu45l252 kt bu45l254 2.4v ab bu45k242 cy bu45k244 fw bu45l242 ks bu45l244 2.3v aa bu45k232 cx bu45k234 ft bu45l232 kr bu45l234 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 3/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet lineup - continued table 2. cmos output type counter timer delay time settings 1-pin gnd 3-pin gnd 200ms 400ms 200ms 400ms detection voltage marking part number marking part number marking part number marking part number 4.8v cw bu46k482 fs bu46k484 kp bu46l482 p m bu46l484 4.7v ct bu46k472 fr bu46k474 kn bu46l472 p k bu46l474 4.6v cs bu46k462 fp bu46k464 km bu46l462 p h bu46l464 4.5v cr bu46k452 fn bu46k454 kk bu46l452 p g bu46l454 4.4v cp bu46k442 fm bu46k444 kh bu46l442 p f bu46l444 4.3v cn bu46k432 fk bu46k434 kg bu46l432 p e bu46l434 4.2v cm bu46k422 fh bu46k424 kf bu46l422 p d bu46l424 4.1v ck bu46k412 fg bu46k414 ke bu46l412 p c bu46l414 4.0v ch bu46k402 ff bu46k404 kd bu46l402 p b bu46l404 3.9v cg bu46k392 fe bu46k394 kc bu46l392 p a bu46l394 3.8v cf bu46k382 fd bu46k384 kb bu46l382 ny bu46l384 3.7v ce bu46k372 fc bu46k374 ka bu46l372 nx bu46l374 3.6v cd bu46k362 fb bu46k364 hy bu46l362 nw bu46l364 3.5v cc bu46k352 fa bu46k354 hx bu46l352 nt bu45l354 3.4v cb bu46k342 ey bu46k344 hw bu46l342 ns bu46l344 3.3v ca bu46k332 ex bu46k334 ht bu46l332 nr bu46l334 3. 2 v by bu46k322 ew bu46k324 hs bu46l322 np bu46l324 3.1v bx bu46k312 et bu46k314 hr bu46l312 nn bu46l314 3.0v bw bu46k302 es bu46k304 hp bu46l302 nm bu46l304 2.9v bt bu46k292 er bu46k294 hn bu46l292 nk bu46l294 2.8v bs bu46k282 ep bu46k284 hm bu46l282 nh bu46l284 2.7v br bu46k272 en bu46k274 hk bu46l272 ng bu46l274 2.6v bp bu46k262 em bu46k264 hh bu46l262 nf bu46l264 2.5v bn bu46k252 ek bu46k254 hg bu46l252 ne bu46l254 2.4v bm bu46k242 eh bu46k244 hf bu46l242 nd bu46l244 2.3v bk bu46k232 eg bu46k234 he bu46l232 nc bu46l234 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 4/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage v dd- g nd -0.3 to +6.0 v output voltage nch open drain output v out gnd-0.3 to +6.0 v cmos output gnd-0.3 to vdd+0.3 output current io 70 ma power dissipation (note1, note2) pd 700 mw operating temperature topr -40 to +105 c ambient storage temperature tstg -55 to +125 c (note 1) use above ta=25c results in a 7.0mw l oss per degree. (note 2) when mounted on rohm standard circuit board (70mmx70mmx1.6mm, glass epoxy board). caution: operating the ic over the absolute maximum ratings ma y damage the ic. the damage can either be a short circu it between pins or an open circuit between pins and the internal circuitry. theref ore, it is important to consider circuit protection meas ures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. electrical characteristics (unless otherwise specifi ed ta=-40 to 105c) parameter symbol condition limit unit min. typ. max. operating voltage range v opl v ol 0.4v, r l =470k , ta=25~105c 0.6 - 6.0 v v ol 0.4v, r l =470k , ta=-40~25c 0.9 - 6.0 detection voltage v det v dd =h l, r l =470k (note 1) v det (t) 0.99 v det (t) v det (t) 1.01 v vdet=2.5v ta=25c 2.475 2.5 2.525 ta=-40c to 85c 2.418 - 2.584 ta=85c to 105c 2.404 - 2.597 vdet=3.0v ta=25c 2.970 3.0 3.030 ta=-40c to 85c 2.901 - 3.100 ta=85c to 105c 2.885 - 3.117 vdet=3.3v ta=25c 3.267 3.3 3.333 ta=-40c to 85c 3.191 - 3.410 ta=85c to 105c 3.173 - 3.428 vdet=4.2v ta=25c 4.158 4.2 4.242 ta=-40c to 85c 4.061 - 4.341 ta=85c to 105c 4.039 - 4.364 vdet=4.8v ta=25c 4.752 4.8 4.848 ta=-40c to 85c 4.641 - 4.961 ta=85c to 105c 4.616 - 4.987 detection voltage temperature coefficient v det / ? t -40c~105c - 50 360 ppm/c hysteresis voltage ? v det v dd l h l, r l =470k v det (t) 0.03 v det (t) 0.05 v det (t) 0.08 v high output delay time t plh c l =100pf, r l =100k ( note1, note 2, note 3 ) bu4 xxxx 2g ta=25c 120 200 280 ms ta=-40c to 85c 95 - 460 ta=85c to 105c 85 - 235 bu4 xxxx 4g ta=25c 240 400 560 ta=-40c to 85c 190 - 920 ta=85c to 105c 170 - 470 circuit current when on i dd 1 v dd =v det -0.2v, v det =2.3v~4.8v 0.60 2.30 7.00 a circuit current when off i dd 2 v dd =v det +1.0v, v det =2.3v~4.8v 1.10 2.80 8.00 a high output voltage (pch) v oh v dd =5.0v, i source = 6.8ma, v det (4.3v to 4.8v) vdd-0.5 - v lowoutput voltage (nch) v ol v dd =1.2v, i sink = 2.0ma - - 0.3 v v dd =2.4v, i sink = 8.5ma, v det (2.7v to 4.8v) - - 0.3 v leak current when off ileak v dd =v ds =6.0v (note 1) - - 1.0 a v det (t):standard detection voltage (2.3v to 4.8v, 0.1v st ep) r l :pull-up resistor to be connected between v out and power supply. c l :capacitor to be connected between v out and gnd. (note 1) guarantee is ta=25c. (note 2) t plh :v dd =(v det (t)-0.5v) (v det (t)+0.5v) (note 3) t plh :v dd =please set up the rise up time between v dd =v opl v det more than 10s. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 5/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet block diagrams fig.1 bu45xxxxx series fig.2 bu46xxxxx series vref v out v dd gnd oscillator circuit counter timer v out vref v dd gnd oscillator circuit counter timer downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 6/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet typical performance curves 0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 circuit current:i dd [ua] vdd supply voltage: v dd [v] ta=105c ta=-40c ta=25c [bu45k232g] fig.3 circuit current 0 2 4 6 8 10 12 14 16 0 1 2 3 4 5 6 7 "low" output current:i ol [ma] drain-source voltage: v ds [v] ta=-40c ta=105c ta=25c [bu45k232g] fig.4 low output current vdd=1.2v 0 10 20 30 40 50 0 1 2 3 4 5 "high" output current:i oh [ma] drain-source voltage: v ds [v] ta=-40c ta=105c ta=25c [bu46k232g] fig.5 high output current vdd=3.9v 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 output voltage:v out [v] vdd supply voltage: v dd [v] ta=-40c ta=105c ta=25c [bu45k232g] fig.6 i/o characteristics downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 7/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet 2.1 2.2 2.3 2.4 2.5 2.6 -40 -20 0 20 40 60 80 100 detection voltage:v out [v] temperature:ta[ c] [bu45k232g] low to high (v det + ? v det ) high to low (v det ) 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -40 -20 0 20 40 60 80 100 circuit current when on :i dd1 [ua] temperature: ta[ c] [bu45k232g] typical performance curves - continued fig.7 detection voltage release voltage fig.8 circuit current when on (vdd=v det -0.2v) vdd=2.1v 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 -40 -20 0 20 40 60 80 100 circuit current when off:i dd2 [ua] temperature: ta[ c] [bu45k232g] fig.9 circuit current when off (vdd=v det +1v) vdd=3.3 v 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -40 -20 0 20 40 60 80 100 minimum operating voltage:v opl [v] temperature: ta[ c] [bu45k232g] fig.10 operating limit voltage downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 8/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet typical performance curves - continued 100 120 140 160 180 200 220 240 260 280 300 -40 -20 0 20 40 60 80 100 "high" delay time:tplh [ms] temperature: ta[ c] [bu45k232g] fig.11 output delay time low high 0.0 1.0 2.0 3.0 -40 -20 0 20 40 60 80 100 "low" delay time tphl [s] temperature: ta[ c] [bu45k232g] fig.11 output delay time high low downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 9/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet application information explanation of operation for both the open drain type (fig.13) and the cmos o utput type (fig.14), the detection and release volt ages are used as threshold voltages. when the voltage applied to the v dd pins reaches the applicable threshold voltage, the v out terminal voltage switches from either high to low or fro m low to high. because the bu45xxxxx series uses an open drain output type, it is necessary to connect a pull-up r esistor to v dd or another power supply if needed [the output hig h voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. fig.13 (bu45xxxxx type internal block diagram) fig.14 (bu46xxxxx type internal block diagram) reference data examples of leading (t plh ) and falling (t phl ) output part number t plh [ms] t phl [s] bu45k232g 208 1.4 bu46k232g 208 1.4 v dd =1.8v 2.8v v dd =2.8v 1.8v *this data is for reference only. the figures will vary with the application, so plea se confirm actual operating conditions before use. timing waveform example: the following shows the relationship betwe en the input voltages v dd and the output voltage v out when the input power supply voltage v dd is made to sweep up and sweep down (the circuits a re those in fig. 13 and 14). 1 when the power supply is turned on, the output is unstable from after over the operating limit voltage (v opl ) until t phl . therefore it is possible that the reset signal is not outputted whe n the rise time of v dd is faster than t phl . 2 when v dd is greater than v opl but less than the reset release voltage (v det + ? v det ), the output voltages will switch to low. 3 if v dd exceeds the reset release voltage (v det + ? v det ), the counter timer start and v out switches from l to h. 4 if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a power sup ply fluctuation, v out switches to l (with a delay of t phl ). 5 the potential difference between the detection vol tage and the release voltage is known as the hysteresis width ( ? v det ). the system is designed such that the output does not to ggle with power supply fluctuations within this hysteresis width, t hus, preventing malfunctions due to noise. timing may change depending on application and use. please verify and confirm using practical applicati ons. fig.15 timing waveform v dd v det + v det v det v opl 0v t phl v out t plh t phl t plh v ol v oh v dd vref r1 r2 r3 v dd gnd oscillator circuit counter timer q1 v out v dd reset gnd reset q2 q1 vref r1 r2 r3 v dd oscillator circuit counter timer v out downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 10/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet circuit applications 1. examples of a common power supply detection rese t circuit. application examples of bu45xxxxx series (open drai n output type) and bu46xxxxx series (cmos output type ) are shown below. case1: power supply of microcontroller (v dd 2) differs from the power supply of the reset detection (v dd 1 ). use an open drain output type (bu45xxxxx series) device with a load resistance r l as shown fig.16. case2: power supply of the microcontroller (v dd1 ) is same as the power supply of the reset detection (v dd1 ). use a cmos output type (bu46xxxxx) device or an ope n drain output type (bu45xxxxx) with pull up resisto r between the output and v dd1 . (as shown fig.17) when a capacitance c l for noise filtering is connected to the v out pin (the reset signal input terminal of the microcontroller), please take into account the wave form of the rise and fall of the output voltage (v out ). 2. the following is an example of a circuit applica tion in which an or connection between two types of detection voltage resets the microcontroller. fig. 18 to reset the microcontroller when many independent power supplies are used in the system, or connect a n open drain output type (bu45xxxxx series) to the microcontroll ers input with pull-up resistor to the supply volt age of the microcontroller (v dd3 ) as shown in fig. 18. by pulling-up to v dd3 , output high voltage of micro-controller power s upply is possible. fig.16 open drain output type fig.17 cmos output type v dd1 v dd2 gnd bu45xxxxx c l noise-filtering capacitor r l r st micro controller c l noise-filtering capacitor v dd1 gnd bu46xxxxx r st micro controller v dd2 v dd1 v dd3 gnd r st micro controller r l bu45xxxxx bu45xxxxx downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 11/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet examples of the power supply with resistor dividers . in applications wherein the power supply voltage of an ic comes from a resistor divider circuit, an in -rush current will flow into the circuit when the output level switches fro m high to low or vice versa. in-rush current is a sudden surge of current that flows from the power supply (vdd) to g round (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems operation such as output oscillations, etc. fig. 19 when an in-rush current (i1) flows into the circuit (refer to fig. 19) at the time when output switche s from low to high, a voltage drop of i1r2 (input resistor) will occur in the circuit causing the vdd supply voltage to d ecrease. when the vdd voltage drops below the detection voltage, the outp ut will switch from high to low. while the outp ut voltage is at low condition, in-rush current will stop flowing and th e voltage drop will be reduced. as a result, the ou tput voltage will switches again from low to high which causes an in-rush current and a voltage drop. this operation repeats and will result to oscillation. v out r2 v dd bu45xxxxx bu46xxxxx gnd r1 i1 v1 cin c l i dd v dd v det 0 in-rush current fig. 20 current consumption vs. power supply voltage downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 12/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse pola rity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedanc e ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent n oise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the ef fect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient c ondition. 4. ground wiring pattern when using both small-signal and large-current gnd tr aces, the two ground traces should be routed separa tely but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that t he gnd traces of external components do not cause var iations on the gnd voltage. the power supply and ground lines mu st be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating b e exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this spec ification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epo xy board. in case of exceeding this absolute maximu m rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possib le that the internal logic may be unstable and inru sh current may flow instantaneously due to the internal powering sequen ce and delays, especially if the ic has more than on e power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of gnd wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electro magnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connect ing a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supp ly should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting m ay result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts c ould be due to many reasons such as metal particles, water droplet s (in very humid environment) and unintentional sol der bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely hi gh impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily cha rge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless othe rwise specified, unused input terminals should be c onnected to the power supply or ground line. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 13/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p subst rate layers between adjacent elements in order to k eep them isolated. p-n junctions are formed at the intersecti on of the p layers with the n layers of other elemen ts, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the p-n junction oper ates as a parasitic diode. when gnd > pin b, the p-n junction operates as a para sitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can re sult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substr ate) should be avoided. figure 21. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between v dd pin and gnd and 1000pf capacitor between vout pin and gnd. be careful when using extremely big capacitor as transient response will be affected. 15. the vdd line impedance might cause oscillation becaus e of the detection current. 16. a vdd to gnd capacitor (as close connection as possible ) should be used in high vdd line impedance condition . 17. external parameters the recommended parameter range for rl is 50k to 470k . there are many factors (board layout, etc) that c an affect characteristics. please verify and confirm u sing practical applications. 18. lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 19. power-on reset operation please note that the power on reset output varies w ith the v dd rise time. please verify the behavior in the actua l operation. 20. this ic has extremely high impedance terminals. sm all leak current due to the uncleanness of pcb surfa ce might cause unexpected operations. application values in these conditions should be selected carefully. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 14/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet physical dimension, tape and reel information package name ssop3 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reser ved. tsz02201-0r7r0g300130-1-2 tsz22111 ? 15 ? 001 15/15 03.july.2014 rev.005 bu45kxxxx, bu46kxxxx, bu45lxxxx, bu46lxxxx series datasheet revision history date revision changes 03.feb.2014 004 new release 03.july.2014 005 updated fig.5 vdd condition updated operational notes and notice downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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